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This machine is mainly used for thermal bonding assembly of cells, Mylar films and base supports. Its processes include
cell feeding, Mylar film feeding, base support feeding, Mylar film thermal bonding, CCD inspection and cell unloading.
Machine dimension (L*W*H): 92000*4000*2800mm
Machine weight: 17 tons
Technical Parameters
1. Production efficiency: ≥15 PPM
2. Cell positioning accuracy: ≤±0.5mm
3. Welding speed: 200mm/s
4. Thermal bonding temperature: Ambient temperature ~ 300℃
5. Temperature stability: ±3℃
6. Thermal bonding pulling force: ≥10N
7. Taping accuracy: ±1mm
8. Failure rate: ≤2%
9. Product yield: ≥99.85%
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