Three-Stage Vacuum Potting Machine

· Product Description

Potting is finished under vacuum condition to eliminate air bubbles and guarantee product sealing,
insulation and structural stability.
Application: potting of electronic PCB, semiconductor, sensor, connector, automotive ECU module, power battery PACK,
photovoltaic inverter and energy storage module.

Technical Parameters
1. Overall dimension(W×D×H):2750mm×1300mm×2000mm
　 (customizable)
2. Control mode: PLC + servo
3. Potting mode: 3D fixed-point dispensing along programmed
　path
4. Max XYZ moving speed:250mm/s
5. Repeat positioning accuracy:±0.03mm
6. Conveying direction: left-in right-out / right-in left-out
7. Conveying type: speed chain / roller, with bottom return
　circulation available
8. Max conveying speed:100mm/s
9. Max vacuum degree:-90Kpa (pumping speed:100m³/H
　within 60s)
10. Vacuum leakage rate:≤3KPa/Min
11. Weighing calibration function optional
12. Multi-stage vacuum pump optional for higher vacuum
　degree
13. Connectable with production conveyor for fully automatic
　production